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ManufacturerCHIP QUIK
Manufacturer Part NoSMD291AX10
Order Code1850223
Product RangeChip Quik - No-Clean Solder Paste
Technical Datasheet
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Quantity | Price (ex VAT) |
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Product Information
ManufacturerCHIP QUIK
Manufacturer Part NoSMD291AX10
Order Code1850223
Product RangeChip Quik - No-Clean Solder Paste
Technical Datasheet
Flux TypeNo Clean
Solder Alloy63, 37 Sn, Pb
Melting Temperature183°C
Weight - Metric35g
Weight - Imperial1.235oz
Product RangeChip Quik - No-Clean Solder Paste
SVHCLead (14-Jun-2023)
Product Overview
No-clean solder paste in syringe applicator with plunger and tip.
- Printing speeds up to 100mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- Passes BONO test
- Alloy: Sn63/Pb37
- Shelf life: <gt/>12 months (refrigerated), <gt/>6 months (unrefrigerated)
Technical Specifications
Flux Type
No Clean
Melting Temperature
183°C
Weight - Imperial
1.235oz
SVHC
Lead (14-Jun-2023)
Solder Alloy
63, 37 Sn, Pb
Weight - Metric
35g
Product Range
Chip Quik - No-Clean Solder Paste
Technical Docs (2)
Associated Products
1 Product Found
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:38101000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:No
RoHS Phthalates Compliant:To be advised
SVHC:Lead (14-Jun-2023)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.04