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SMD291SNL250T3
Solder Paste, Synthetic No Clean, 220 °C, 96.5, 3, 0.5 Sn, Ag, Cu, 250G
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| Quantity | Price (ex VAT) |
|---|---|
| 1+ | zł218.390 |
| 3+ | zł203.830 |
Price for:Each
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Multiple: 1
zł218.39 (ex VAT)
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Product Information
ManufacturerCHIP QUIK
Manufacturer Part NoSMD291SNL250T3
Order Code3549314
Technical Datasheet
Flux TypeSynthetic No Clean
Solder Alloy96.5, 3, 0.5 Sn, Ag, Cu
Melting Temperature220°C
Weight - Metric250g
Weight - Imperial8.82oz
Product Range-
SVHCNo SVHC (17-Dec-2015)
Product Overview
No-clean, lead-free solder paste in 250g jar.
- Printing speeds up to 100mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- Passes BONO test @ 1.56%
- Alloy: Sn96.5/Ag3/Cu0.5
- Shelf life: <gt/>6 months (refrigerated), <gt/>2 months (unrefrigerated)
Technical Specifications
Flux Type
Synthetic No Clean
Melting Temperature
220°C
Weight - Imperial
8.82oz
SVHC
No SVHC (17-Dec-2015)
Solder Alloy
96.5, 3, 0.5 Sn, Ag, Cu
Weight - Metric
250g
Product Range
-
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:38101000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.272