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TS391LT
Solder Paste, Synthetic No Clean, 138 °C, 42, 57.6, 0.4 Sn, Bi, Ag, 15G
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| Quantity | Price (ex VAT) |
|---|---|
| 1+ | zł143.440 |
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zł143.44 (ex VAT)
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Product Information
ManufacturerCHIP QUIK
Manufacturer Part NoTS391LT
Order Code3549321
Technical Datasheet
Flux TypeSynthetic No Clean
Solder Alloy42, 57.6, 0.4 Sn, Bi, Ag
Melting Temperature138°C
Weight - Metric15g
Weight - Imperial0.53oz
Product Range-
SVHCNo SVHC (17-Dec-2015)
Product Overview
No-clean, lead-free, low temperature thermally stable solder paste in syringe applicator with plunger and tip.
- Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components
- Printing speeds up to 125mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- No refrigeration required
- Alloy: Sn42/Bi57.6/Ag0.4
Technical Specifications
Flux Type
Synthetic No Clean
Melting Temperature
138°C
Weight - Imperial
0.53oz
SVHC
No SVHC (17-Dec-2015)
Solder Alloy
42, 57.6, 0.4 Sn, Bi, Ag
Weight - Metric
15g
Product Range
-
Technical Docs (2)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:83113000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.026