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TS391SNL50
Solder Paste, Synthetic No Clean, 220 °C, 96.5, 3, 0.5 Sn, Ag, Cu, 50G
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45 In Stock
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| Quantity | Price (ex VAT) |
|---|---|
| 1+ | zł154.920 |
Price for:Each
Minimum: 1
Multiple: 1
zł154.92 (ex VAT)
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Product Information
ManufacturerCHIP QUIK
Manufacturer Part NoTS391SNL50
Order Code3549324
Technical Datasheet
Flux TypeSynthetic No Clean
Solder Alloy96.5, 3, 0.5 Sn, Ag, Cu
Melting Temperature220°C
Weight - Metric50g
Weight - Imperial1.76oz
Product Range-
SVHCNo SVHC (17-Dec-2015)
Product Overview
No-clean, lead-free, thermally stable solder paste in 50g jar.
- Printing speeds up to 125mm/sec.
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- T4 mesh
- No refrigeration required
- Alloy: Sn96/Ag3/Cu0.5
Technical Specifications
Flux Type
Synthetic No Clean
Melting Temperature
220°C
Weight - Imperial
1.76oz
SVHC
No SVHC (17-Dec-2015)
Solder Alloy
96.5, 3, 0.5 Sn, Ag, Cu
Weight - Metric
50g
Product Range
-
Technical Docs (2)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:38101000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.072