Tape Automated Bonding

Tape Automated Bonding is a process that places bare integrated circuits onto a printed circuit board (PCB) by attaching them to fine conductors in a polyamide or polyimide film, thus providing a means to directly connect to external circuits. TAB offers the advantage of allowing a circuit to be tested at high frequencies and proving it in good condition without the expensive alternative of mounting it in a module for testing, thus avoiding the need to rework modules.